InSCOPE will be present at the ESTC2018 

 Our representative of InSCOPE project, Mr. Kimmo Keränen from VTT, Finland – Sensing and integration department, will give a presentation related to R2R processing capability improvement realized within InSCOPE project. Title of the manuscript and presentation is “High throughput R2R printing, testing and assembly processing of flexible RGB LED displays”  and will be presented in ESTC2018 conference in Dresden, on 20th September- starting at 10:45 . Paper is based on achievements in InSCOPE project from work package 2 (dedicated to equipment and processes) and work package 3 (focussed on Printed functionalities and assembly schemes).