InSCOPE team is pleased to announce the projects participation at the Smart System Integration International (SSI2018) Conference and Exhibition held from 11. to 12. of April in Dresden. The main focus of this exhibition and conference is on integration issues of miniaturized systems – MEMS, NEMS, ICs and electronic components. Imec, a partner of InSCOPE project, will give an oral presentation on smart low-cost approaches including Roll-to-Roll technologies and printed functionalities

If this is of your interest, please do not hesitate to visit, the exhibition is free of charge. In order to register for the conference follow this link.