News

  CPI & InSCOPE project and ReMedieES project invite you to attend this one day event to showcase recent development and future opportunities in smart packaging.   The event features a series of presentations from industry experts in hybrid and embedded printable electronics, discussions, networking and a tour of CPI’s newly expanded printable electronics scale-up facility. Join us to hear about CPI’s input as a collaborative ...

InSCOPE Showcases Interactive Media Surface Panel from KONE Corporation

Lopec is a meeting place for all the important players from printed electronics community. InSCOPE team had a pleasure to exhibit at Lopec this year, presenting the latest results and funding opportunities together with SmartEEs and Lyteus, the H2020 projects related to the flexible electronics technologies. Visitors to our booth could discover some remarkable solutions of printed electronics technologies and benefit ...

  If you still have not made your mind to visit LOPEC 2018, InSCOPE team might help you to sort it out. InSCOPE has 20 free tickets available for you to attend. As one of the exhibitors, we would like to highlight pilot lines and digital innovation hub for flexible electronics prototyping as they are worth exploring.  InSCOPE will jointly exhibit ...

Mr. Mike Clausen from CPI, member of InSCOPE project, contributed to the InSCOPE effort to introduce the possibilities to integrate hybrid and printed electronics in products at 2017 International Conference on Flexible and Printed Electronics.

New- Tech magazine Europe published InSCOPE efforts. Enjoy a nice article HERE  

Meeting in OULU  Partners met in Oulu after 6 months of the pilot line preparation for large area organic printed electronics operation. KONE Corporation and VTT demonstrated animated RGB content mapped on led matrix. See a vide0 how it will be incorporated.

InSCOPE: is ready to take an action The kick-off meeting of a new Horizon 2020 project took place in Eindhoven (the Netherlands) in January 2017. A team took the first action to create an open access pilot line service for hybrid printed electronics. During the KOM, partners discussed technical issues related to the concept to be developed.

Researchers from Holst Centre, imec and Royal Philips have produced the first ever prototype of a curved photodetector on a plastic substrate. The breakthrough paves the way for smaller optical and 3D imaging X-ray systems with better, more uniform image quality. A prototype curved X-ray detector has been integrated into a medical cone-beam CT (CBCT) demonstrator that will be presented ...

https://www.youtube.com/watch?v=S9e-9skrnsU

  We all love electronics and we are surrounded by them all around. There is a huge demand for low cost and seek for flexible devices with low weight. The Market need pushed new manufacturing concepts to come up and enable an impossible. Read more at: http://www.printedelectronicsworld.com/articles/10847/what-does-printed-organic-flexible-electronics-mean-for-you.

Stretchable electronics will become a $600m market by 2027 Read more at: http://www.printedelectronicsworld.com/articles/10768/stretchable-electronics-no-longer-a-solution-looking-for-a-problem

InSCOPE achievements in Printed functionalities, assembly schemes and types of equipment. Read our latest publication “High throughput R2R printing, testing and assembly processing of flexible RGB LED displays” on how R2R processing capability improvement was realized within InSCOPE project.

InSCOPE Showcases Interactive Media Surface Panel from KONE Corporation

InSCOPE_figures, team, vision, mission  

MULTI-DISCIPLINARY EUROPEAN CONSORTIUM DEVELOPS OPEN ACCESS PILOT LINE SERVICE FOR HYBRID & PRINTED SYSTEMS TO ACCELERATE INDUSTRIAL UPTAKE

InSCOPE will be present at the ESTC2018   Our representative of InSCOPE project, Mr. Kimmo Keränen from VTT, Finland – Sensing and integration department, will give a presentation related to R2R processing capability improvement realized within InSCOPE project. Title of the manuscript and presentation is “High throughput R2R printing, testing and assembly processing of flexible RGB LED displays”  and will be presented in ESTC2018 ...

  CPI & InSCOPE project and ReMedieES project invite you to attend this one day event to showcase recent development and future opportunities in smart packaging.   The event features a series of presentations from industry experts in hybrid and embedded printable electronics, discussions, networking and a tour of CPI’s newly expanded printable electronics scale-up facility. Join us to hear about CPI’s input as a collaborative ...

Lopec is a meeting place for all the important players from printed electronics community. InSCOPE team had a pleasure to exhibit at Lopec this year, presenting the latest results and funding opportunities together with SmartEEs and Lyteus, the H2020 projects related to the flexible electronics technologies. Visitors to our booth could discover some remarkable solutions of printed electronics technologies and benefit ...

InSCOPE team is pleased to announce the projects participation at the Smart System Integration International (SSI2018) Conference and Exhibition held from 11. to 12. of April in Dresden. The main focus of this exhibition and conference is on integration issues of miniaturized systems – MEMS, NEMS, ICs and electronic components. Imec, a partner of InSCOPE project, will give an oral ...

  If you still have not made your mind to visit LOPEC 2018, InSCOPE team might help you to sort it out. InSCOPE has 20 free tickets available for you to attend. As one of the exhibitors, we would like to highlight pilot lines and digital innovation hub for flexible electronics prototyping as they are worth exploring.  InSCOPE will jointly exhibit ...

AIPIA believes that implementation of new technologies in packaging is key to growth, enhance efficiency, reduce waste and increase sales. InSCOPE will attend the final overview of the upcoming World Congress on Active & Intelligent Packaging in Amsterdam. We are looking forward to attending an impressive program with 50 Speakers, around 300 delegates and groundbreaking technologies to fight waste, brand protection, consumer engagement and ...

Fostering collaboration among all players along the value chain was one of the priority in already the 41st OE-A Working Group Meeting, organized in Cambridge on October 10-11, 2017. This time with a focus on Sensor applications enabled by Printed Electronics. InSCOPE coordinator Mr. Corne Rentrop joined the meeting as an opportunity to meet end-users and experts in the fild of Printed electronics ...

Meet InSCOPE coordinator at the International Conference on Flexible and Printed Electronics (ICFPE 2017), which will take place on 5 – 7 September 2017, at Jeju Island, South Korea. The annual conference highlights challenges, emerging processes and applications in printing process. Registration is still open (click HERE).

InSCOPE visited Thessaloniki in Greece! Not only beautiful landscape tempted us to be there but also one of the largest technology event NANOTEXNOLOGY 2017, 1 – 8 July 2017 that holds variety type of conferences. The InSCOPE project was presented in Flexible Organic & Printed Electronics (OEs) part, that promotes the Research, Technology, and Innovation in OE nanomaterials, Manufacturing Processes, Devices and Applications, ...

The EuroNanoForum 2017 Conference (ENF2017) took place in Valletta, Malta under the auspices of the Maltese Presidency of the European Union. During the event, over 600 delegates (scientists, industry, policy makers from the nanotech community) from all over the world gathered to discuss and outline how nanotechnologies and advanced materials can revitalize manufacturing in Europe.  During the ENF2017 event, InSCOPE pilot line project, which aims ...