CPI & InSCOPE project and ReMedieES project invite you to attend this one day event to showcase recent development and future opportunities in smart packaging.
The event features a series of presentations from industry experts in hybrid and embedded printable electronics, discussions, networking and a tour of CPI’s newly expanded printable electronics scale-up facility. Join us to hear about CPI’s input as a collaborative ... MORE
Lopec is a meeting place for all the important players from printed electronics community. InSCOPE team had a pleasure to exhibit at Lopec this year, presenting the latest results and funding opportunities together with SmartEEs and Lyteus, the H2020 projects related to the flexible electronics technologies.
Visitors to our booth could discover some remarkable solutions of printed electronics technologies and benefit ... MORE
InSCOPE team is pleased to announce the projects participation at the Smart System Integration International (SSI2018) Conference and Exhibition held from 11. to 12. of April in Dresden. The main focus of this exhibition and conference is on integration issues of miniaturized systems – MEMS, NEMS, ICs and electronic components. Imec, a partner of InSCOPE project, will give an oral ... MORE
If you still have not made your mind to visit LOPEC 2018, InSCOPE team might help you to sort it out. InSCOPE has 20 free tickets available for you to attend. As one of the exhibitors, we would like to highlight pilot lines and digital innovation hub for flexible electronics prototyping as they are worth exploring.
InSCOPE will jointly exhibit ... MORE
AIPIA believes that implementation of new technologies in packaging is key to growth, enhance efficiency, reduce waste and increase sales. InSCOPE will attend the final overview of the upcoming World Congress on Active & Intelligent Packaging in Amsterdam. We are looking forward to attending an impressive program with 50 Speakers, around 300 delegates and groundbreaking technologies to fight waste, brand protection, consumer engagement and ... MORE
Fostering collaboration among all players along the value chain was one of the priority in already the 41st OE-A Working Group Meeting, organized in Cambridge on October 10-11, 2017. This time with a focus on Sensor applications enabled by Printed Electronics. InSCOPE coordinator Mr. Corne Rentrop joined the meeting as an opportunity to meet end-users and experts in the fild of Printed electronics ... MORE
Meet InSCOPE coordinator at the International Conference on Flexible and Printed Electronics (ICFPE 2017), which will take place on 5 – 7 September 2017, at Jeju Island, South Korea. The annual conference highlights challenges, emerging processes and applications in printing process. Registration is still open (click HERE).
InSCOPE visited Thessaloniki in Greece!
Not only beautiful landscape tempted us to be there but also one of the largest technology event NANOTEXNOLOGY 2017, 1 – 8 July 2017 that holds variety type of conferences. The InSCOPE project was presented in Flexible Organic & Printed Electronics (OEs) part, that promotes the Research, Technology, and Innovation in OE nanomaterials, Manufacturing Processes, Devices and Applications, ... MORE
The EuroNanoForum 2017 Conference (ENF2017) took place in Valletta, Malta under the auspices of the Maltese Presidency of the European Union. During the event, over 600 delegates (scientists, industry, policy makers from the nanotech community) from all over the world gathered to discuss and outline how nanotechnologies and advanced materials can revitalize manufacturing in Europe. During the ENF2017 event, InSCOPE pilot line project, which aims ... MORE
10-11 May 2017, Berlin. Focused on the commercialisation of printed, organic and flexible electronics. Read more at: http://www.idtechex.com/printed…